Tantalum Nitride Films Grown by Inorganic Low Temperature Thermal Chemical Vapor Deposition Diffusion Barrier Properties in Copper Metallization

Abstract

Key findings are presented from a systematic study which evaluated the performance of chemical vapor deposited (CVD) nitrogenrich tantalum nitride films as a diffusion barrier in copper (Cu) based metallization schemes. For this purpose, 3800 Å thick Cu films were grown by physical vapor deposition (PVD) on 550 Å thick films which were deposited by low temperature (<425°C) thermal CVD (TCVD) using tantalum pentabromide , ammonia, and hydrogen as coreactants. The resulting stacks were annealed in argon ambient at 450, 500, 550, and 650°C for 30 min each, along with similar PVD Cu/PVD bilayers of identical thickness. Both types of pre‐ and postannealed stacks were characterized by X‐ray photoelectron spectroscopy, Auger electron spectroscopy, Rutherford backscattering spectrometry, nuclear reaction analysis for hydrogen profiling, X‐ray diffraction, stack sheet resistance measurements, and Secco chemical treatment and etch‐pit observation by scanning electron microscopy. The resulting findings showed that the PVD films provided an excellent barrier against Cu diffusion throughout the annealing window investigated. Alternatively, the TCVD films exhibited similar stability up to 550°C. Barrier failure occurred, however, at temperatures between 550 and 600°C, as revealed by the formation of etch pits after Secco etch treatment. The failure of the TCVD films could not be attributed to bromine incorporation, given that residual bromine (∼0.5 atom %) in the TCVD films was highly stable against thermal diffusion in the temperature window investigated. Instead, the higher thermal stability of the PVD was attributed to differences in film microstructure and crystalline phase, or the location of excess nitrogen within the film matrix. © 1999 The Electrochemical Society. All rights reserved.