Abstract
The introduction of surface mount technology has changed the approach which is needed for successful rework of components. This has been brought about by the requirement of simultaneous reflow of all joints to remove the component from the board. To meet this need, manual soldering methods have been adapted, and subsequently complemented, with dedicated hot bar, hot gas and infra‐red systems. Each of these techniques with their respective applicability is considered, prior to a discussion of the parameters which need to be addressed before embarking on successful rework. All aspects of component, board and the joint itself are considered. The procedure for addressing rework is then laid out, providing a standard methodology to obtain rework joints which maintain the quality of the production joints.
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