Abstract
Chemical vapour deposition in a cold wall reactor working at atmospheric pressure was used to study the homoeptaxial growth of 4H-SiC on 4°ff misoriented substrates from silane and propane precursors. The effect of various growth parameters (temperature 1450-1650°C, C/Si ratio 1-7, thickness 2.5-10 µm) were studied in order to determine the best conditions for obtaining smooth surfaces after epitaxy. It is shown that the main source of roughness is surface undulation which easily appears during growth, especially at low C/Si ratios and high temperature (up to 1600°C). Temperatures above 1600°C and C/Si ratio of 1 give the best results. When reducing temperature, a trade-off has to be found between defects formation and surface undulation.
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