Abstract
The hard as well as brittle constituents are typically difficult-to-machined materials, and this character upsurges the machining cost. Many non-traditional machining methods were developed to improve its cost-effectiveness. Ultrasonic vibration assisted grinding has been improved the processing performance of a variety of brittle materials, and achieved good results in processing application. In this study, engineering ceramic was precisely sawn using a thin diamond blade with or without ultrasonic vibration conditions. During the sawing process, the specific sawing energy was investigated with the measurement of sawing forces to explore the influence of ultrasonic vibration. The results showed that the ultrasonic vibration made a significant reduction in specific sawing energy. The specific sawing energy decreased with the increase of the maximum undeformed chip thickness in both the sawing conditions; however ultrasonic vibration changed the trend of specific sawing energy in normal cutting mode from exponentially decreasing to a good linear decreasing. Under the ultrasonic vibration assisted sawing condition, the impact of the diamond grain on the engineering ceramic caused to much more material removal in brittle fracture mode. The reducing of the plastic transformation also reduced the energy consumption during the engineering ceramic sawing process.
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