Abstract
A method for reducing the amount of copper (Cu) electrode side etching at the micro-nano scale by multi-step etching process was proposed. Taking the positive photoresist (PR) BP212 as a masking layer, the Cu electrode was patterned by two etching solutions, which can effectively reduce the side etching. The x-ray diffraction (XRD) test showed that the intermediate product formed on the surface of Cu during the corrosion of FeCl3 solution was cuprous chloride (CuCl). The removal of CuCl by KCl solution instead of FeCl3 solution greatly reduced the residence time of Cu in FeCl3 solution; The effect of different concentrations of FeCl3 solution on reducing the amount of side etching was studied. The result shows that the FeCl3 solution with mass concentration of 0.03 g ml−1 was used for multi-step etching, and the amount of side etching is reduced from 25 μm to 5 μm.
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