Abstract

In the manufacture of precision electronic components, defects are detected using automatic inspection machines. When high inspection sensitivity is employed, the group of potentially defective candidates identified by the inspection machine can include many acceptable units; this can ultimately lead to an excessive number of incorrect defect detections. This study aims to develop an effective method for classifying images of defect candidates into defect images and good images. Herein, the inspection method of electronic components with various defective images generated from the true defect images is proposed.

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