Abstract
A new design method of highly reliable thermally conductive packaging material is proposed for the heat dissipation problem of high-density packaging of chips. The high reliability is obtained by high temperature condensation of AlN particles suspension of PAA. Focusing on the influence law of the content of AIN on the electronic packaging material, the experimental results show that the thermal conductivity reaches 3.8 W/(m⋅K) when the mass percentage of AIN reach more than 60%. The Td in N2 is 524°C. The surface of AIN is modified by the macromolecular coupling agent GBM to increase the compatibility of AIN with the Polymeric materials. The tensile strength of PI/AlN composite is 170 MPa, and the material has good insulation performance when the temperature rises to 200°C under 120 kV/mm electric field, which meets the application requirements of high-density chip packaging.
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