Study of Wirebonding Loop Formation and Influencing Factors Based on Mechanical Mechanics

Abstract

Mechanical dynamics and mechanical kinematics analysis of the loop deformation are researched. Because of the complex mechanical dynamics relationship between capillary trajectory and loop profile, its difficult to study the process of wirebonding. Lo has proposed a linkage-spring model to simulate the process. This paper simulated the loop profile through linkage-spring model, and validated it by experiments. After that, the Taguchi method has been developed to characterize the various looping parameters. The studies show that the kink height has a strong influence on the loop height and the sagging height, the wire length is a critical factor to the deformation of the wire near the first bond.