Abstract
In this study, the single event effects in In0.53Ga0.47As/In0.3Ga0.7As/In0.7Ga0.3As composite channel InP-based HEMT are investigated using TCAD simulation for the first time. Due to the higher conduction band difference between bottom In0.7Ga0.3As channel and InAlAs buffer, the electrons in the buffer layer induced by ions strike cannot enter the channel, led to reduce the peak concentration in the composite channel and significantly weakened the drain current for composite channel device. Meanwhile, higher barrier height under the gate for composite channel InP-based HEMT is formed after particle strike, and further attenuate the drain current. Therefore, the single event effects can be effectively reduced by designing channel structure. In addition, drain voltage and incident position also show significant impact drain current. With the increase in the drain voltage, the drain current increase and the most sensitive incident position is the gate electrode for the device.
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