Studies of Morphological Instability and Dislocation Formation in Heteroepitaxial Si1−xGex Thin Films Via Controlled Annealing Experiments

Abstract

AbstractHeteroepitaxial Si1−x Gex thin films deposited on silicon substrates exhibit surface roughening via surface diffusion under the effect of a compressive stress which is caused by a lattice mismatch. In these films, surface roughening takes place in the form of ridges aligned along either <100> or <110> directions depending on the film thickness and composition. In this paper, we compare the relaxation behaviour of capped and uncapped heteroepitaxial Si1−xGex thin films containing 22% Ge, with surface roughening being inhibited in films with a capping layer. Films with 50 nm thickness were deposited on bare silicon substrates in a LPCVD reactor. Annealing experiments were conducted in a Hydrogen atmosphere in the reactor chamber. Transmission electron microscopy and atomic force microscopy have been used to study the surface morphology and microstructure of these films. XRD measurements were conducted to determine the amount of relaxation in these films. In-situ transmission electron microscopy/annealing experiments have been performed on uncapped Si1−x Gex/Si structures to study the dynamics of surface roughening and defect formation in a vacuum ambient. Finally, we compare surface morphologies and defects in samples subjected to annealing in vacuum and H2 ambients.