Abstract
AbstractIt has been demonstrated that an epoxy‐polyamide film is susceptible to be oxidized and degraded on a copper surface at elevated temperature. The amino and amide groups in the epoxy resin are oxidized to nitriles and the polymeric backbone is thermally degraded by the catalysis of copper, resulting a sharp reduction in adhesion between the epoxy resin and copper substrate after aging at 200°C for 30 min. By pretreating the copper surface with polyacrylonitrile, the thermal stability of the coating and the interfacial adhesion can be significantly improved.
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