Abstract
ABSTRACT With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research.
Highlights
In the electronics industry, solder joints connect electronic components with the printed circuit boards [1]
The research of microstructure is vital for evaluating lead-free solder since the microstructure of solder directly determines the properties of the solder and the solder joints
It is evident that the addition of Al promotes the wetting of solder alloys, which attributes to the decrease of surface tension of liquid solders due to the high activity of Al element
Summary
Solder joints connect electronic components with the printed circuit boards [1]. Traditional Sn-Pb solder was widely used in the electronic packaging industry because of its performance advantages. EU and other countries and regions have promulgated laws to gradually prohibit the use of lead in the electronic packaging [2–7]. These initiatives provide a good opportunity for the development of new lead-free solder. There is still potential for the further development of Sn-Cu solder alloys with higher properties. In order to research several properties of Sn-Cu solder alloys, a lot of researches have been done, including the structure/interface evolution, the wettability and mechanical properties, by means of alloying, particle strengthening and solidification rate control. The wettability, mechanical properties and melting properties of Sn-Cu lead-free solders were analysed. Mater. 20 (2019) 422 alloying and particle strengthening methods, the research results of modification of solders were discussed
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