Abstract
Copper and other metallic films deposited onto a vacuum-heat-treated tungsten substrate are prepared by ion plating for film thicknesses from 5 to 30 μ. The fracture cross section and surface morphology of films are examined by means of a scanning electron microscope. The structure of ion-plated films formed under usual plating conditions is, in general, a columnlike (or spongelike) structure containing a number of microporosities. In some cases, the layered structure of dense–porous is observed. When the ionization of metallic atoms is enhanced during the ion plating using three auxiliary cathodes with hot filaments, the film consists of dense and equiaxed structure. Further, the effect of film structure on mechanical properties of films (Knoop hardness, friction, and wear) is also examined.
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