Abstract
AbstractIn the bending process of a foldable panel, constrained deformation of patterned structures causes local stress concentrations, which results in the damage of internal components or module stacks. In the present work, a unit‐cell finite element method (FEM) model was used to simulate the bending stress in opening thin film transistor (TFT) structures of a foldable active matrix organic light‐emitting diode (AMOLED) panel. Two different opening methods are compared, and the effect of bending radius is further discussed. The simulation results show that the opening structure can slightly decrease the stress around the hole. The influence of the opening on the stress reduction is gradually increased with the decrease of the bending radius. The simulation results provide the basis for optimizing the TFT structure and improving foldable performance of AMOLED devices.
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