Abstract
The stress-corrosion cracking (SCC) of ultra-fine grain (UFG) severely pre-deformed copper immersed into 1 M NaNO 2 aqueous solution is investigated in terms of transient anodic current and fracture morphology. It is found that UFG copper possesses notably better resistance to SCC when compared to its coarse-grain counterpart. In contrast to the coarse grain copper, which fractures transgranularly in a cleavage manner, SCC in UFG specimens occurs intergranularly. The primary role of grain boundaries in SCC of UFG materials is argued from both mechanical and electrochemical aspects. The relatively high resistance to stress-corrosion damage in the UFG state and the intergranular type of SCC are connected with microstructural features of ECA-processed materials. Phenomenology of SCC is discussed from the standpoint of the film rupture and slip dissolution model specified for the severely pre-deformed materials.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
