Abstract
Thermal stress analysis for a SOFC stack under combined pressure loading and rejected heat due to stack operation is presented. An integrated temperature function of the rejected heat generated by the cell and ambient temperature settings provided a first-hand study of the effects of thermal expansion, stress and deformation for a steady-state case. The analysis involved using the temperature gradient across the cells while 20 Amps was being drawn from them. To allow for uniform thermal expansion of the stack without causing erroneous stresses, the constraints were set to allow frictionless expansion in the horizontal plane on the bottom compression plate while also fixing the bottom compression plate in the vertical plane. Displacement observations showed maximum expansion and stresses occurring at maximum temperature once the unit cell reached that temperature, however, minor changes were seen in stress variations, displacements and deflections.
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