Abstract
Mechanically mixing was adopted to prepare SiC-particulate reinforced Sn–3.7Ag–0.9Zn composite solders and the effects of SiC addition on the solidification behavior, melting behavior and the corresponding microhardness of air-cooled composite solders were explored. It is found that the addition of SiC particles into the Sn–3.7Ag–0.9Zn alloy melt prompts the formation of primary β-Sn phase in the solidified structure. For the SiC particles serve as additional nucleation sites for the formation of primary β-Sn phase, the sizes of both the β-Sn dendrites and the intermetallic compounds (IMCs) decrease gradually with the SiC particles increasing. The hard SiC particles and refined β-Sn dendrites and IMCs could obstruct the dislocation slipping and thus lead to a strong strengthening effect in the composite solder.
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