Abstract

Plastic relaxation in metamorphic high electron mobility transistor (MHEMT) structures was investigated by x-ray reciprocal mapping and high-resolution transmission electron microscopy (HRTEM). X-ray data indicates that In(Ga)AlAs M buffers with a linearly graded buffer and an inverse step are completely strain compensated at the buffer-active area interface. HRTEM shows reduction of dislocation density from 109 to 106 cm−2 through the M buffer. Optimized MHEMT structures were found to exhibit low rms roughness of around 2 nm and excellent electrical transport properties. MHEMT devices with 0.15 μm gates were fabricated with a transconductance of 710 mS/mm, maximum current of 500 mA/mm, and gate–drain breakdown of 6.6 V. A maximum ft value of 118 GHz and a maximum rf gain of 18 dB at 10 GHz were measured at a drain current of 200 mA/mm.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.