Abstract
A high energy ion projector under construction will allow mask controlled ion beam implantation at demagnification between 10× and 100×. For energetic ions the material of the mask must be chosen in view of the required values of the stopping power and heat conduction. Thermal expansion and sputter effects are to be minimised. In a first experiment a 16× reduced projection of a copper mask with 20 μm wide structures was realized. To improve the resolution to 250 nm on the target mask structures of 4μm are required.
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