Statistical Analysis of Lifetime Distribution of Time-Dependent Dielectric Breakdown in Cu/Low-k Interconnects by Incorporation of Overlay Error Model

Abstract

We propose a method for the statistical analysis of a via-to-line time-dependent dielectric breakdown (TDDB) test under misalignment impacts. The √E and overlay error models are incorporated into the lifetime distribution analysis in the framework of the Weibull regression model. The doubly truncated normal distribution effectively describes the space-decrease distribution that is estimated using the overlay error model. Incorporating these physical and statistical characteristics into the lifetime distribution analysis yields more reliable distribution parameters and helps to distinguish outliers as early failures with rejection of misalignment impacts.