Abstract
In the course of our studies on variable reflection windows involving copper deposition, we have proposed to use P (EO) n KCu x I 1+ x complexes. The excess I − ions stabilizes copper (I) through formation of [CuI n+1 ] n− and the transport of copper is solely due to the diffusion of anionic complexes which acts as copper vehicles. Copper electrodeposition has been observed. The stripping of the copper layers strongly depends upon the relaxation time between the copper plating and the beginning of the anodic voltametric scan. The copper deposit slowly vanishes with time. A cathodic current is observed before the copper plating process which we relate to the possible reduction of an oxidizing species present in the electrolyte. The search for such oxidizing species (Cu 2+, I − 3) has been made using ESR and Raman spectroscopy and we have shown the presence of I − 3).
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