Abstract

Digital image correlation (DIC) is a powerful, length-scale-independent methodology for examining full-field surface deformations. Recently, it has become possible to combine DIC with scanning electron microscopy (SEM), enabling the investigation of small-scale deformation mechanisms such as the strains accommodated within grains in polycrystalline metals, or around micro-scale constituents in composite materials. However, there exist significant challenges that need to be surmounted before the combination of DIC and SEM (here termed SEM-DIC) can be fully exploited. One of the primary challenges is the ability to pattern specimens at microstructural length scales with a random, isotropic and high contrast pattern needed for DIC. This paper provides a thorough survey of small-scale patterning methods for SEM-DIC and discusses their advantages and disadvantages for different applications.

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