Abstract
The implications of various size effects on the deformation behavior of and near grain boundaries is not yet fully understood. In this manuscript, slip transfer mechanisms through a general high angle grain boundary (HAGB) allowing for easy transfer are investigated in order to understand the size dependence of the dislocation-grain-boundary interaction. Complementary in situ micro compression tests on copper single and bi-crystals in the scanning electron microscope and with x-ray Laue microdiffraction were used to correlate the mechanical response with the evolving microstructure. It is shown that no dislocation pile-up is formed at the boundary. The lack of pile-up stresses results in a deformation process which is dominated by the initial dislocation source statistics. This is evidenced by similar size scaling of the single and bi-crystalline samples with the grain size being the characteristic length scale.
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