Abstract
System-in-package looks to be an attractive option for projects that cannot justify a system-on-chip approach. SiP is a functional building block containing multiple die and possibly discretes in one semiconductor package. Its key advantage is adaptability, as the approach is appropriate for low or high volumes, and can handle mixed die and process technologies. SiP designs should also have lower development and non-recurring engineering (NRE) costs than SoC approaches. Among the disadvantages were the cumulative yields losses involved in linking the many devices that make up an SIP lower performance, and the availability or otherwise of known good die. System-in-package looks to be an attractive option for projects that cannot justify a system-on-chip approach. But there are many obstacles still to be overcome before it becomes mainstream, say people working with the technology.
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