Abstract
New developments in deep reactive ion etching (DRIE) technology, when combined with silicon fusion bonding (SFB), make it possible, for the first time, to span nearly the entire range of microstructure thicknesses between surface and bulk micromachining, using only single-crystal silicon. The combination of these two powerful micromachining tools forms a versatile new technology for the fabrication of micromechanical devices. The two techniques are described and a process technology is presented. Some of the experimental structures and devices that have been demonstrated using this new process technology are discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
