Abstract
The thermal reliability and electrochemical corrosion of Au/Pd (electroless palladium/immersion gold, EPIG) and Au/Pd/Au (immersion gold/electroless palladium/immersion gold, IGEPIG) surface finishes over Cu traces were characterized in this study. The predeposition of a Au nanolayer over Cu (i.e., IGEPIG case) served as the catalysts for the electroless reduction of Pd2+ ions and modified the polycrystalline Pd structure (EP) into a dense Pd film with limited grain boundaries and nanochannels/nanovoids. This phenomenon greatly improved the thermal reliability and corrosion resistance of the Au/Pd/Cu structure (EPIG case), even though the predeposited Au film was only 10 nm thick.
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