SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

Abstract

In order to take full advantage of SiC, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested. The details of the material comparison and selection are described, thus culminating a feasible solution for high-temperature operation. A thermal cycling test with large temperature excursion (from -55°C to 250°C) was carried out to evaluate the thermomechanical reliability of the package. During the test, the substrate failed before other parts in 20 cycles. A sealing edge approach was proposed to improve the thermal reliability of the substrate. With the strengthening of the sealing material, the substrate, die-attachment, and wirebond assemblies exhibited satisfactoriness in the thermomechanical reliability tests. In order to evaluate the high-temperature operation ability of designed package, one prototype module was designed and fabricated. The high-temperature continuous power test shows that the package presented in this paper can perform well at 250°C junction temperature.