Sequencing optimisation for makespan improvement at wet-etch tools

Abstract

The complex nature of wet-etch tools and their peculiar scheduling constraints pose a relevant challenge for the development and implementation of makespan optimisation strategies, especially when rigid scheduling rules have to be considered. In this paper, an optimisation model is developed for sequencing of wafer batches outside a wet-etch tool and scheduling of tool-internal handler moves. The scheduling algorithm is inspired by the control logics governing wet-etch tools operating in a real semiconductor manufacturing plant and proves effective in generating efficient and detailed schedules in short computational times. The mathematical formulation developed for the scheduling problem is based on generic and realistic assumptions for both the job flow and the material handling system. The sequencing module combines an exact optimisation approach, based on an efficient permutation concept, and a heuristics optimisation approach, based on genetic algorithms. The results obtained show that significant makespan reductions can be obtained by means of a mere sequencing optimisation. Using this optimisation strategy, variations to the scheduling logics, that are generally more difficult and expensive to implement, are avoided. A sensitivity analysis on genetic algorithm operators is also conducted and considerations on the best performing selection, cross-over and mutation operators are presented.