Semi-IPNs formed from poly(ethylene glycol monomethyl ether acrylate) and an epoxy thermoset

Abstract

Poly(ethylene glycol monomethyl ether acrylate) (PEGMEA) was synthesized from the reaction of poly(ethylene glycol monomethyl ether) (PEGME) with acryloyl chloride. Semi-IPNs based on various weight ratios of diglycidyl ether of bisphenol A (DGEBA)/PEGMEA were prepared, using isophronediamine (IPDA) and 2,2′-azo-bis(isobutyronitrile) (AIBN) as curing agents. The glass transition temperature and exothermic peak shifts were studied with differential scanning calorimetry (DSC). Viscosity changes during semi-IPN formation were measured with a Brookfield viscometer. Dynamic mechanical properties were investigated by rheometric dynamic spectroscopy (RDS). Stress–strain curves were obtained with an Instron tensile tester, while impact resistance was measured with a computer aided falling dart impact tester. Experimental results revealed retarded curing rates for all semi-IPNs, as evidenced from the shifts of curing exothermic peaks to higher temperatures, together with retarded viscosity increases during semi-IPN formation. These phenomena were interpreted in terms of chain entanglement between epoxy and PEGMEA. Nevertheless, the semi-IPNs indicated good compatibility as inferred from a single Tg in DSC and a single damping peak in RDS for each semi-IPN. Improved tensile stress and strain along with toughness improvements were noticed for this semi-IPN system. Shear band yielding was proposed to interpret this result. © 1999 Society of Chemical Industry