Abstract
In this paper a new semi empirical equation describing the track diameters of α particles in CR-39 is presented. The equation involves three free fitting parameters. It is shown that this equation can reproduce tracks diameter formed on the CR-39 by alpha particles at 3.1MeV, different etching times and temperature (70, 75, 80, 85) oC . Parameters values obtained from the experimental data were used to predict etched track diameters at different temperatures (T=70-85)oC and etching times (t=0-6)h. The suggested empirical equation is self consistent as far as reproducing all features of track diameter development as a function of etching time and temperature.
Highlights
The etching of solids is a highly complex phenomenon including dynamical and chemical processes involving both the chemical activity (Dörschel et al, 2003; Gaillard et al, 2005 a, b) and the diffusion of the solution through the surface into bulk material
The possibility of performing alpha particle energy analysis has been of interest to many research groups (Espinosa and Silva, 2001), (Ditlov, 2005)
Distance between the source and detector (2.4 cm) corresponding to the measured alpha particle energy of 3.1 MeV was selected because this energy causes a maximum damage in the detector (El Ghazaly, 2012; Hamzeh et al, 2012)
Summary
The etching of solids is a highly complex phenomenon including dynamical and chemical processes involving both the chemical activity (interaction of ions and molecules in solution with each other) (Dörschel et al, 2003; Gaillard et al, 2005 a, b) and the diffusion of the solution through the surface into bulk material. The possibility of performing alpha particle energy analysis has been of interest to many research groups (Espinosa and Silva, 2001), (Ditlov, 2005). Energy and direction of the incident particle can be investigated by measuring the track profile after etching the latent tracks at properly chosen as the concentration C of the etching solution and its temperature T (Hermsdorf et al, 2007; Hermsdorf, 2012). These parameters strongly influence the etching processes for removing non-irradiated material and the revealing of the tracks
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