Abstract
ABSTRACTA process has been developed for the deposition of patterned adherent metal on diamond substrates using low temperature processing conditions. CVD diamond films on Si wafers were oxidized with an RFO2 plasma and subsequently functionalized by attachment of self-assembled ultrathin films (UTFs) to the oxidized diamond surface. The UTFs were exposed to patterned deep UV radiation, and selectively metallized by electroless (EL) deposition. EL Ni and Co patterns, with feature sizes to 20 μm linewidth have been produced. Oxidized and UTF-modified surfaces were characterized by surface spectroscopie and wettability techniques. The EL metal deposits on the diamond substrate passed the Scotch tape adhesion peel test.
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