Abstract
We have studied selective epitaxial growth of silicon in the SiCl2H2/HCl/H2 system. Our results on growth rate and selectivity are reported here. We found that the growth rate and selectivity are strong functions of the partial pressures of HCl, SiCl2H2, H2, exposed Si area, and wafer position. We propose that growth and selectivity are controlled by surface reactions between SiCl2H2 and HCl and the SiO2 and Si surfaces. Higher HCl flow rates decrease the adsorption coefficients and/or incorporation rates of the reactive SiCl2H2(g) species on both SiO2 and Si. When either is zero for SiO2 and both are greater than zero on Si, selective depositions occur. Finally, we present data on the effect various SiO2 surface treatments have on the density and distribution of Si nuclei on this surface.
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