Abstract
The adsorption behavior of glycerol, erythritol, xylitol and glucose on copper surface was investigated via molecular dynamics simulation, in order to predict the effect of additive on throwing power of copper pyrophosphate bath, and then the electrochemical analysis was conducted to verify this prediction. The experimental data supported the simulation result, i.e., the pyrophosphate bath in presence of glycerol has the best throwing power. It is demonstrated that the molecular dynamics simulation is a promising tool with good accuracy for the additive screening in electroplating process.
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