Scalable and reusable micro-bubble removal method to flatten large-area 2D materials

Abstract

Bubbles generated during electro-delamination and chemical etch during large-area two-dimensional (2D) material transfer has been shown to cause rippling, and consequently, results in tears and wrinkles in the transferred film. Here, we demonstrate a scalable and reusable method to remove surface adhered micro-bubbles by using hydrophobic surfaces modified by self-assembled monolayers (SAMs). Bubble removal allows the 2D film to flatten out and prevents the formation of defects. Electrical characterization was used to verify improved transfer quality and was confirmed by increased field-effect mobility and decreased sheet resistance. Raman spectroscopy was also used to validate enhanced electrical quality following transfer. The bubble removal method can be applied to an assortment of 2D materials using diverse hydrophobic SAM variants. Our studies can be integrated into large scale applications and will lead to improved large-area 2D electronics in general.