SAM meets MEMS: reliable fabrication of stable Au-patterns embedded in PDMS using dry peel-off process

Abstract

This paper describes a reliable method for fabrication of stable gold patterns embedded in polydimethylsiloxane (PDMS) using a direct peel-off process. Two different surface modifications with self-assembled monolayers were carried out for easy and reliable transfer of Au micro-patterns to the PDMS: (1) perfluorodecyltrichlorosilane on a Si substrate for easy release of the Au patterns from the Si substrate, and (2) (3-mercaptopropyl)trimethoxysilane on the Au patterns to promote the adhesion between the Au patterns and PDMS. Au features as small as 2 μm, in shapes of line and dots, were successfully transferred from the Si substrate to the PDMS over a 3-inch wafer. Transfer of Au patterns to PDMS using the dry peel-off process did not cause any contamination of PDMS, typically seen in wet chemical methods. Finally, the stability of the Au patterns embedded in PDMS was confirmed by the Scotch-tape adhesion test.