S0440101 酸化銅ナノ粒子のレーザ直接還元を利用した銅細線パターニング([S044]次世代3Dプリンティング,機械材料・材料加工部門)

Abstract

CuO nanoparticles were directly reduced to form fine Cu micropatterns using femtosecond laser pulses. CuO nanoparticles were dispersed into reductant agent and base-polymers. When the focused laser pulses were irradiated into the CuO nanoparticle based films on glass substrates, the Cu micropatterns were formed by reducing and sintering of CuO nanoparticles. XRD spectrum of the laser irradiated areas shows Cu peaks although the Cu peaks were not observed in XRD spectra of the non-irradiated area. The width of the Cu micropatterns were increased by decreasing laser pulse energy and increasing laser scanning speed. The minimum line width was 7 μm under the condition that the laser pulse energy and scanning speed were 0.36 nJ and 100 μm/s, respectively. When the pulse energy was low and the scanning speed was high, the line width of the Cu micropatterns only depended on the pulse energy, not the scanning speed. This result indicates that the threshold fluence could exist to form Cu micropatterns.