Abstract
The net shape fabrication of a range of electroceramic devices and thick films is described. The fabrication routes involve producing homogeneous and formable ceramic dough using a viscous polymer processing technique, with various subsequent shape-forming operations to produce devices with sizes ranging from tens of millimetres to tens of microns. The advantages of these processing routes are discussed and examples of large (>1 mm) planar and 3-D components (hemispheres, tubes and helices) and structures with small (<150 μm) feature sizes (thick films and microrod arrays) are presented.
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