Abstract
In the anodic electropolishing of Cu, Pb, Sn, W, Mo, Cd, Ag, Ti, U, In and Zn in anhydrous sulphamic-acid-formamide solutions, the polishing proceeds via formation of semiconducting anodic films. It is shown that the solid state properties (eg band gaps, lattice energies) of these films may be correlated with electropolishing rates of these metals obtained from the potentiostatic polarization curves of Menzies, Marshall and Griffin. The theoretical significance of these correlations is discussed. The analysis presented is similar in approach to our previous interpretation of anodic dissolution of 23 materials, mostly metals, in anhydrous hydrogen fluoride. The considerations developed here further support the previously presented viewpoint, namely, that in electroinorganic reactions involving solid reaction films, the solid state properties of these films influence profoundly the electrochemical behaviour of film-covered electrodes.
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