Abstract
The exploration of PCBMEMS as a path towards systems development continues. PCBMEMS technology based on rigid-flexible laminates is desirable for miniaturization and integration of systems for mobility and harsh environment deployments. The technology provides substantial flexibility in systems design and integration of multiple functions into limited spaces. Using this design and construction approach allows lightweight, complex, and space efficient systems. Flex microsystems based on structurable, non-fiber filled laminates permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday systems. Examples will be given where the technology is being applied toward several different systems including mobile chemical analyzers, heat and mass transfer devices, portable therapeutics, augmented mobile phone systems, and high density microfluidics-based robotics.
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More From: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
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