Abstract
Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research groups have primarily dealt with the understanding of the thermal conductivity of these types of TIMs. Thermal resistance is not only dependent on the thermal conductivity but also on the bond line thickness (BLT) of these TIMs. It is not clear that which material property(s) of these particle laden TIMs affects the BLT. This paper discusses the experimental measurement of rheological parameters such as non-Newtonian strain rate dependent viscosity and yield stress for 3 different particle volume fraction and 3 different base polymer viscosity materials. These rheological and BLT measurements vs. pressure will be used to model the BLT of particle-laden systems for factors such as volume fraction.
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