Abstract
The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts’ material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method.
Highlights
Thanks to new materials, new manufacturing processes, and new device configurations, the efficiency of light-emitting diode (LED) products has continuously improved since their wide application in the field of commercial and household illumination
We found that light output stayed more or less at a certain level, the outside environment of stacked RGB light emitting diode (LED) varied with fulfilled heat sink oil
All these results demonstrate that the glass circuit boards (GCB) stacked LED modules with stacked LED modules with oil encapsulation (OCP) is a reliable method to vertically stack multiple RGB LEDs together
Summary
New manufacturing processes, and new device configurations, the efficiency of light-emitting diode (LED) products has continuously improved since their wide application in the field of commercial and household illumination. After their simulation and test validation, the 3D LED exhibits an overall homogeneous emission propose a stacking multi-chip RGB LED module with a transparent submount which exhibits and reveals a visual proof of satisfactory internal color mixing [15]. When multi-chips stack together in a high-power operation, the parasitic heat accumulation must be solved simultaneously because one major factor in determining the lumen output of an LED is its junction temperature. The light-generation process becomes less efficient and fewer lumens are emitted For this reason, LED chips generally require a good thermal handling system. To detail the heat accumulation phenomenon in our proposed stacking GCB FCLED module, the power- or current-dependent electrical and optical performance was measured for both single device and multi-chip array, for different colors. TracePro software (TracePro 7.0, Lambda Research Corp., Littleton, MA, USA) was used to check the corresponding optical mounting design
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