Abstract
Electrostatic voltage is a vital parameter in industrial production lines, for reducing electrostatic discharge harms and improving yields. Due to such drawbacks as package shielding and low resolution, previously reported electric field microsensors are still not applicable for industrial static monitoring uses. In this paper, we introduce a newly designed microsensor package structure, which enhances the field strength inside the package cavity remarkably. This magnification effect was studied and optimized by both theoretical calculation and ANSYS simulation. By means of the digital synthesizer and digital coherent demodulation method, the compact signal processing circuit for the packaged microsensor was also developed. The meter prototype was calibrated above a charged metal plate, and the electric field resolution was 5 V/m, while the measuring error was less than 3 V, from −1 kV to 1 kV in a 2 cm distance. The meter was also installed into a production line and showed good consistency with, and better resolution than, a traditional vibratory capacitance sensor.
Highlights
Electrostatic voltage is a key parameter in industrial production lines, which quantitatively indicates the static charge in products
In on our previous work [41], we found the effectiveness of a non-flat package structure and reported some measured results
Electrostatic voltage measurement is a key factor in the electrostatic discharge (ESD) control area
Summary
Electrostatic voltage is a key parameter in industrial production lines, which quantitatively indicates the static charge in products. When it is exceeded, electrostatic discharge (ESD) most likely happens to cause direct breakdown or invisible inner damage [1]. ESD protection technologies have been taken into consideration in the circuit designs [2,3,4], in the preliminary stages of manufacturing, the fundamental elements are still under risks of ESD failure. Screen factories, static charge might arise to 5000 volts on glasses, after such manufacturing processes as surface cleaning, physical vapor deposition, and photoetching [5,6,7]. The batch production of integrated circuits and surface mount technology (SMT) processes face similar problems [8].
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