Abstract
The temperature range of general military and civil electronic reliability research is - 55°C ~400°C. But in deep space exploration, the extreme low temperature and large changing condition without thermal guarantee will give a great challenge to the service reliability of electronic interconnection structures and normal operation of the equipment. The low temperature brittleness is the serious problem of the Sn-Pb solder or Sn-Ag, Sn-Cu and Sn-Ag-Cu lead-free solders. In-Pb solder which has good toughness at extremely low temperature is a promising solder for deep space exploration. In this paper, the evolution mechanism of microstructure and mechanical properties of solder alloys in extreme conditions, and the reliability of solder joints and welded structures both domestic and abroad are reviewed.
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