Research on Preparation of Ni/SiO2 Optical Attenuation Slice by Magnetron Sputtering

Abstract

In order to find new methods for preparing and improving the performance of optical attenuation slice. Vacuum magnetron sputtering method was used to prepare Ni/SiO2 composite film optical attenuation slices, with vacuum magnetron sputtering apparatus, at 5,10,15,20,25min sputtering time, 0.2,0.4,0.6,0.8,1.0Pa sputtering pressure and sputtering power 300~1200W. The XRD, SEM, EDS, AFM and 722 spectrophotometer also were used to study the effects of different sputtering time, sputtering pressure and sputtering power on the film structure, surface morphology, composition, three-dimensional structure, surface roughness and light attenuation rate of optical attenuation slice samples. The results indicated that: Ni/SiO2 composite films were formed, instead of simple physical adsorption between Ni film and SiO2 substrates with magnetron sputtering by XRD analysis and calculation, with uniform grain size of 25.96, 32.38, 32.29,26.95, 25.92nm, respectively. The main component element was Ni, but there were few impurities deposited on the substrates. Impurities were reduced gradually with the increase of sputtering time, mainly resulted from two sputtering of Ni atoms by EDS; The film surface was smooth and dense, flatness and organizational structure of Ni film were better, surface roughness was 1.267nm at 25min sputtering time, 0.4Pa pressure and 400W power with SEM and AFM. Light attenuation rate of optical attenuation slices was different in different process parameters, and the maximum reached 0.52, film flatness, impurities and defects were the main reason by the light attenuation performance analysis.