Abstract
With the rapid development of social science and technology, various industries have higher and higher requirements for the quality of electronic products. SMT surface mount technology is the most popular process in the electronics assembly industry, and reflow soldering is one of the SMT mounting processes. Reflow soldering is mainly used to solder the circuit boards with components already attached. The solder paste is melted by heating to fuse the chip components and the circuit board pads together, and then the solder paste is cooled by the cooling of the reflow soldering, and the components are soldered. The plates are solidified together, and the furnace temperature curve records the temperature changes of the circuit board during this process. This article focuses on the printed circuit board welding production problem, through optimizing the furnace temperature curve for high-efficiency and quality-guaranteed production, and researches on the changes of the furnace temperature curve at different temperatures.
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