Abstract
TiN films were deposited by remote plasma enhanced atomic layer deposition (PEALD) method using tetrakis-dimethyl-amino-titanium precursor and hydrogen, hydrogen/nitrogen mixture, and nitrogen plasmas. Remote PEALD method showed a relatively wide temperature window compared to that of conventional ALD process due to the increased reactivity of reactant gas. TiN films showed significantly lower impurity contents than those of the films deposited by other methods such as plasma enhanced chemical vapor deposition, metalorganic chemical vapor deposition, and conventional ALD using the same precursor. TiN films deposited using N2 plasma showed better characteristics than the films deposited using H2 and H2/N2 mixture plasmas. TiN films deposited by remote PEALD at 250 °C showed the resistivity value as low as about 300 μΩ cm and exhibited excellent conformal step coverage on 0.25-μm-wide and 2.5-μm-deep contact hole structure.
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