Abstract
Over the years the reliability and durability of c-Si and thin-film photovoltaic (PV) modules and balance-of-system (BOS) components have improved consistently. This paper reviews performance of PV modules and BOS components and discusses the role of encapsulants, adhesional strength, impurities, metallization, solder bond integrity and breakage, corrosion, backing layers, junction boxes and high-voltage bias testing in relation to their effect on module and inverter reliability. It is suggested that the concepts of physics of reliability of electronic packages will be useful to understand, address and resolve new problems in PV module and inverter reliability.
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