Abstract
This paper describes several methods for reduction of electromagnetic emissions (EME) of mixed signal integrated circuits (IC). The focus is on the impact that a LIN bus communication block has on a complex IC which contains analog blocks, noisy digital block, microcore (μC) and several types of memories. It is used in an automotive environment, where EMC emission reduction is one of the key success factors. Several proposed methods for EME reduction are described and implemented on three test chips. These methods include current consumption reduction, internal on-chip decoupling, ground separation and different linear voltage regulator topologies. Measurement results of several fabricated test chips are shown and discussed.
Highlights
The automotive industry is known for a harsh environment for electronic circuits, mainly with respect to used semiconductors, starting with a very wide temperature operating range, ESD pulses, transients present on supply and signal lines, requirements for very low emission and high immunity to electromagnetic disturbances [1].Due to continuous progress in manufacturing technology of integrated circuits (IC), the electromagnetic compatibility (EMC) of electronic systems plays increasing role in circuit performance
The digital block is the origin of EMC emissions due to the transient current flowing through each elementary logic gate
This paper focuses on practical EMC emissions improvements to a complex mixed signal IC for automotive applications with an embedded LIN driver in the frequency range from 10 MHz to 120 MHz
Summary
The automotive industry is known for a harsh environment for electronic circuits, mainly with respect to used semiconductors, starting with a very wide temperature operating range, ESD pulses, transients present on supply and signal lines, requirements for very low emission and high immunity to electromagnetic disturbances [1]. The number of devices inside a single integrated circuit and the clock speed increase resulting in higher electromagnetic emissions [2]. Integrated circuits for automotive applications have to be designed with a strong focus on reduction of the EMC emissions. The primary focus of the paper is on reduction of EMC emissions of a complex automotive mixed signal IC containing substantial analog content including output drivers, ADCs and DACs, and a digital core including memories and LIN bus drivers. Measurement results are presented, compared with expectations and conclusions are drawn
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