Recent trends of package warpage and measurement metrologies

Abstract

Current consumer products are designed based on an “outside in” process where parameters such as consumer experience and portability are prioritized to define the system and component design and performance targets. This drives innovation in electronic packaging to challenge the existing design boundaries and norms. One of the challenges faced by the electronic industry is managing the package warpage characteristics for seamless component to board assembly process. As part of a continuous effort, iNEMI has collaborated with individual companies to establish a sampling of current trends of electronic packaging warpage, and also initiated an effort to evaluate state-of-the-art dynamic warpage measurement metrologies. The former objective has provided a new batch of donated parts for warpage characterization which included Package on Package (PoP) memory, System in Package (SiP), Fine pitch Ball Grid Array (FBGA) as well as Flip Chip BGA (FCBGA) with and without a lid (heat spreader). The dynamic warpage metrologies considered were based on thermal shadow moire, 3D digital image correlation (3D DIC), fringe projection moire and confocal technique. In this paper, the majority of the work covered will be the dynamic warpage characteristics of donated components and a brief description of metrologies under consideration.