Abstract
The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.
Highlights
IntroductionThe fast growth of the electronics industry has raised demand for epoxy-based thermally conductive adhesives to face challenges in cooling high-performance devices [1]
The fast growth of the electronics industry has raised demand for epoxy-based thermally conductive adhesives to face challenges in cooling high-performance devices [1].Traditional thermal management is not sufficient to cool high heat-producing electronic chips
The results indicate that each sample thepowders, thermal diamond conductivity of epoxy adhesive by eight different fillerZnOispowders capable of significantly increasing the thermal conductivity of the epoxy resin
Summary
The fast growth of the electronics industry has raised demand for epoxy-based thermally conductive adhesives to face challenges in cooling high-performance devices [1]. Epoxy-based thermally conductive adhesive (TCA) is a potential solution for joining components and removing the extra heat generated during the device’s operation. These adhesives are used for joining chips and substrates, metal components, polymer composites, and concrete structures, which are challenging for other techniques. TCAs are applied in particular tasks in electronics industries like dustries like die attachment process in LED packaging, PCB fabrication, advanced therdie attachment process in LED packaging, PCB fabrication, advanced thermally conductive mally conductive composites production, chip-scale packages, and power semiconduccomposites production, chip-scale packages, and power semiconductors.
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